high-voltage spark gap protectors (spg) revision january 06, 2014 1 / 4 @ un semiconductor co., ltd. 2014 specifications are subject to change without notice. please refer to www.unsemi.com.tw for current information. UNC-302M un semiconductor co., ltd. www.unsemi.com.tw u approximately zero leaking current before clamping voltage u less decay at on/off state. u high capability to withstand repeated lightning strikes. u low electrode capacitance ( 1.0pf) and high isolation ( 100m ? ). u rohs compliant. u bilateral symmetrical. u temperature, humidity and lightness insensitive. u working temperature: -25 ~ +65 u storage temperature: -25 ~ + 85 u meets msl level 1, per j-std-020 u power supplies u motor sparks eliminating u relay switching spark absorbing u data line pulse guarding u electronic devices requiring ul497a and ul497b compliant u telephone/fax/modem u high frequency signal transmitters/receivers u satellite antenna u radio amplifiers u alarm systems u cathode ray tubes in monitors/tvs (1) series (2) v s voltage, e.g. 302=30x10 2 =3000v (3) v s voltage tolerance: m - 20% symbol inches millimeters l1 1.102 0.118 28.0 3.0 l 0.197 0.012 5.0 0.3 d 0.020 0.002 0.5 0.05 d 0.122 0.012 3.1 0.3 applications features part numbering un c - 3 02 m (1) (2) (3) dimensions
high-voltage spark gap protectors (spg) revision january 06, 2014 2 / 4 @ un semiconductor co., ltd. 2014 specifications are subject to change without notice. please refer to www.unsemi.com.tw for current information. UNC-302M un semiconductor co., ltd. www.unsemi.com.tw part number dc spark-over voltage vs(v) minimum insulation resistance ir(ohm)/dc maximum capacitance 1khz-6vmax c (pf) surge current capacity 8/20 s ac withstanding voltage UNC-302M 3000(2400~3600) 100m / 500v 1.0 3000a ac1500v, 3min. part number color code1 color code2 color code3 UNC-302M orange black red items test method standard dc spark-over voltage measure starting discharge voltage (vs) by gradually increasing applied dc voltage. test current is 0.5ma max. and the dc voltage ascends up within 100v/s(vs 1000v) or 500v/s(vs 1000v). insulation resistance measure the insulation resistance across the terminal at regular voltage. but the test voltage doesn t over the dc spark-over voltage. capacitance measure the electrostatic capacitance by applying a voltage of less than 6v (at 1khz) between terminals. rate-of-change, within 30% insulation resistance & capacitance, conformed to rated spec. static life 10kv with 1500pf condenser is discharged through 2k ? resistor. 200 times at an interval of 10sec. O O vs/vs 30% characteristics of other items must meet the specified value surge current capacity 1.2/50 s & 8/20 s, 3000a, electrically connected with a resistor (1~2 ? ), 5 times, each time interval 60 seconds. thereafter, outer appearance shall be visually examined. no crack and no failures cold resistance measurement after -40 /1000 hrs & normal temperature/2 hrs. heat resistance measurement after 125 /1000 hrs & normal temperature/2 hrs. humidity resistance measurement after humidity 90~95 (45 ) /1000 hrs & normal temperature/2 hrs. temperature cycle 10 times repetition of cycle -40 /30min normal, temp/2 min 125 /30min, measurement after normal temp/2 hrs. features are conformed to rated spec solder ability apply flux and immerse in molten solder 230 5 for 3sec up to the point of 1.5mm from body. check for solder adhesion. lead wire is evenly covered by solder solder heat measurement after lead wire is dipped up to the point of 1.5mm from body into 260 5 solder for 10sec conformed to rated spec pull strength apply 0.5kg load for 10sec flexural strength bend lead wire at the point of 2mm from body under 0.25 load and back to its original point. repeat 1 time. lead shall not pull out to snap test methods and results electrical characteristics color code
high-voltage spark gap protectors (spg) revision january 06, 2014 3 / 4 @ un semiconductor co., ltd. 2014 specifications are subject to change without notice. please refer to www.unsemi.com.tw for current information. UNC-302M un semiconductor co., ltd. www.unsemi.com.tw flow soldering conditions reflow soldering conditions 1) time shown in the above figures is measured from the point when chip surface reaches temperature. 2) temperature difference in high temperature part should be within 110 . 3) after soldering, do not force cool, allow the parts to cool gradually. hand soldering solder iron temperature: 350 5 heating time: 3 seconds max. general attention to soldering u high soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence strength, and the change of characteristic may occur. u for soldering, please refer to the soldering curves above. however, please keep exposures to temperatures exceeding 200 to fewer than 50 seconds. u please use a mild flux (containing less than 0.2wt% ci). also, if the flux is water soluble, be sure to wash thoroughly to remove any residue from the underside of components that could affect resistance. cleaning when using ultrasonic cleaning, the board may resonate if the output power is too high. since this vibration can cause cracking or a decrease in the adherence of the termination, we recommend that you use the conditions below: frequency: 40khz max. output power: 20w/liter cleaning time: 5 minutes max. recommended soldering conditions 250 soldering cooling air preheat 200 150 100 50 0 t 150~180 260 60~120 sec 3~4 sec temperature ( ) 250 soldering cooling air preheat 200 150 100 50 0 t 150~180 260 60~120 sec 10 sec. or less temperature ( ) 60 sec. or less
high-voltage spark gap protectors (spg) revision january 06, 2014 4 / 4 @ un semiconductor co., ltd. 2014 specifications are subject to change without notice. please refer to www.unsemi.com.tw for current information. UNC-302M un semiconductor co., ltd. www.unsemi.com.tw symbol dimension (mm) w 52+2.0/-1.0 p 5.0 0.5 t 6.0 1.0 z 1.2 max l1-l2 1.0 max s 0.8 max t 3.2 max l 5.0 0.3 d1 0.5 0.05 d 3.1 0.5 tape r 1.0 max item description length a=255 mm width b=75 mm height c=68 mm quantity 1500 pcs inner box package there are upper and bottom board to protect the parts from damage. packaging
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